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RFIC Design Engineer

Linz, Austria
Full-time
Permanent employee

About the Job

Bridgecom Semiconductors is a growing tech startup specializing in 5G solutions, with locations in Munich and Linz. As a Senior Staff RFIC Design Engineer at Bridgecom, you will be a key expert responsible for the design and implementation of our high-performance RF Transceivers. You will own the development of critical silicon building blocks up to the receiver and transmitter chains that enable next-generation 5G/6G IoT platforms. Working closely with our technical leadership, you will ensure these chains meet 3GPP standards and integrate seamlessly with external Front-End components.

Your Responsibilities

  • RF Chain & Block Ownership: Own the full design cycle (concept to silicon) of building blocks and their integration into complete RX and TX chains, including LNAs, Mixers, Pre-PAs, and integrated Baseband Filters.
  • RF Levelplanning: Translate high-level system requirements and 3GPP standards into detailed chip-level parameters. You will derive specifications for gain, noise, and linearity across the lineup to ensure the transceiver meets global regulatory and performance targets.
  • Strategic Problem Resolution: Act as a technical anchor by translating complex, detailed RF problem statements into crisp, actionable problem statements and resolution plans. You will drive these plans to completion, ensuring alignment across design, layout, and system teams.
  • High-Fidelity EM Simulation: Actively perform electromagnetic (EM) modeling of on-chip passives (inductors, transformers, MOM caps) and high-frequency interconnects. You will drive the simulation flow to ensure an excellent correlation between pre-silicon models and post-silicon laboratory measurements.
  • Crosstalk & Integration: Proactively identify and mitigate complex integration effects, such as on-chip crosstalk (x-talk) and substrate noise coupling, using EM solvers to secure performance and stability before tape-out.
  • Chain-Level Execution: Design and optimize transceiver line-ups, conducting detailed budget analysis (Gain, NF, $IIP3$, Phase Noise) to hit aggressive system targets.Front-End Interface Collaboration: Optimize the silicon-level interface between the Transceiver IC and external RF Front-End (RFFE) components (External LNAs, PAs, and filters).
  • Structured Problem Solving: Use disciplined methodologies (e.g., 8D, Fishbone) to root-cause and resolve complex RF anomalies during silicon bring-up.

Your Profile

  • Node Expertise: Advanced design experience in FinFET and SOI technologies, with a deep understanding of layout effects, reliability, and parasitic management.
  • Analytical Clarity: Demonstrated ability to synthesize vast amounts of technical data into clear narratives; skilled at structured problem solving and driving cross-functional resolution.
  • System-to-Silicon Translation: Demonstrated ability to derive block-level specs from 3GPP standards; proficient at spreadsheet-based or tool-based levelplanning and lineup optimization.
  • EM Simulation Power-User: Expert at utilizing EM simulation tools as a core design verification step to achieve high correlation between simulated models and measured silicon results.
  • Measurement & Data Analytics: Highly skilled in conducting hands-on lab characterization and interpreting raw data using Python to drive design refinements.
  • Tool Proficiency: Mastery of industry-standard RFIC design environments (e.g., Cadence Virtuoso, Spectre-RF) and physical sign-off tools (e.g., Siemens Calibre).

Education and Experience

  • Master’s degree in Electrical Engineering or Physics; Ph.D. is a strong plus.
  • 10+ years of hands-on RFIC design experience with a proven track record in high-volume consumer or IoT markets
  • Extensive experience in advanced FinFET and SOI nodes for mobile and IoT applications.

Our Offer

  • The opportunity to work on next-generation 5G RF semiconductor technologies tailored IoT and automotive markets.
  • A dynamic environment where engineers get the full picture of a product development cycle, not just execute isolated tasks.
  • A role that prioritizes engineering rigor, deep-dive silicon characterization, and "designer-as-owner" accountability.
  • An inclusive and diverse team in a thriving tech startup setting.
  • Individual growth opportunities in a growth company. 
  • Continuous learning through collaboration with senior engineers and hands-on exposure across multiple areas of semiconductor development.

Contact Us

We are looking forward to receiving your application including your CV and a Cover Letter.

About us

At Bridgecom, we bring together centuries of combined experience in the wireless semiconductor industry.

Started-up and headquartered in Europe, Bridgecom has gathered senior industry experts, a growing engineering team and a partner network synthesizing experience and technologies into chipset products.

With deep expertise, we turn connectivity into reality, shaping the future of semiconductors in close collaboration with our customers. We are committed to excellence in every step, driving innovation and reliability in the solutions we provide.

We are excited to hear from you if you are enthusiastic about working on cutting-edge cellular technologies and shaping the future of wireless communication. Join us and be part of something great! We are looking for multiple candidates with varying levels of experience to join our team, so do not hesitate to apply if you think you have the skills we need.